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Kanga G3: BGA or QFP?
Posted by: Trash80toHP_Mini on 2011-01-28 09:17:51
Hi gang, has anyone got a Kanga to post a pic of the MoBo or just peek inside to see if it has a Quad Flat Pack or a Ball Grid Array G3 Processor?

QFP = Pins all around the four sides of the chip = MUAHAHAHAHAHAAAAAA!!!!!!!!!!!!!!!!!!!!!!!!!!!!! }🙂

BGA = No pins at all, just a bunch of direct solder connections underneath the chip = Bleh! 😛

This notion came up in another thread and deserves its own topic! 😉

Posted by: Trash80toHP_Mini on 2011-01-28 19:44:29
*^&<$^^%>&*^*&^()**%$!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!! I just tore a 3400c, that was half apart already, all the way down to a freakin' BGA 603e! FEH!!!!

There goes that donor possibility! :disapprove:

I'll keep this thread open in case anyone comes up with another candidate for a QFP G3 donor!
Posted by: techknight on 2011-01-30 09:02:32
for me, BGAs are easier to work with than QFPs. the line up better when reworking. lol. when the balls are melted, it almost pulls right in to exact alignment.
Posted by: MattB on 2011-02-11 09:47:11
How far down do you have to get into a Kanga to get a picture of what you're looking for? I've got two Kangas at home on my desk and I can pop the keyboard off of one of them and take some pictures if that will work. If it requires disassembly beyond that it may be above my level of knowledge.
Posted by: trag on 2011-02-11 13:54:01
I'll keep this thread open in case anyone comes up with another candidate for a QFP G3 donor!
I didn't think there were any QFP G3s. I'm pretty sure they're all BGA, but I've been wrong before...

for me, BGAs are easier to work with than QFPs. the line up better when reworking. lol. when the balls are melted, it almost pulls right in to exact alignment.
Techknight, what equipment/method are you using to solder BGAs and how big have you gone?

I have this Apple TV (original) which is just begging to have its four BGA DDR2 memory chips replaced with larger capacity chips. Going from 256MB to 512MB would make a huge difference in teh amount of disk swap needed when running various flavors of Linux on the thing.

I even have the new memory chips in hand. I don't know when I'll ever have time to work on it, but in the mean time I collect ideas for home BGA soldering. I've been considering building a toaster oven with a relay, thermocouple and microcontroller so I can do temperature profiles.
Posted by: techknight on 2011-02-12 18:37:18
Depends on if there is a stencil available.

I have the stencils for an EBGA64 as that was a VERY common flash IC i used to pull, reprogram and stick back into a device. I also have the programmer/adapter for EBGA64 Flash ICs.

But anyway... I dont have the stencils to reball for any other type of layout. if the IC is already pre-balled then its real easy to align and reflow to mount.

Otherwise, you have to reball the IC which takes a stencil.

as far as equipment, I am cheap so i do things the redneck way. I use a toaster oven to pre-heat the board, and then use a heatgun to bring the IC into reflow.

i use the heatgun and an aluminum plate for reballing, but its easier to use a stencil, alignment bracket, and preformed balls. With a hotplate. thats the best way, but i dont have that setup. just a machined block to be used with solder paste and a heatgun for EBGA64.
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